BondLink
ID: 5627421BondLink is a venture-backed financial technology company developing solutions for issuers in the approximately $4 trillion municipal bond market.
4
Funding Rounds
$26.0m
Money raised
Recent Funding Rounds
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Funding series
Funding Series Analysis
The company BondLink has raised a total of $10m in funding over 4 rounds.
Key Insights:
- BondLink Series A round, January 2017: $10m
- BondLink funding round, January 2018: $10m
- BondLink Inc. funding round, March 2020: $6m
Industries
BondLink is active in the following industries: