Andpad
ID: 5856447A company in Tokyo, Japan that provides a construction management application for users throughout Japan.
1
Funding Rounds
$22.6m
Money raised
Recent Funding Rounds
Overview
A company in Tokyo, Japan that provides a construction management application for users throughout Japan.
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Funding series
Funding Series Analysis
The company Andpad has raised a total of $22.6m in funding over 1 rounds.
Key Insights:
- Andpad Series B round, September 2019: $22.6m